Stabilization of Tetragonal HfO2 under Low Active Oxygen Source Environment in Atomic Layer Deposition

نویسندگان

  • Deok-Yong Cho
  • Hyung Suk Jung
  • Il-Hyuk Yu
  • Jung Ho Yoon
  • Hyo Kyeom Kim
  • Sang Young Lee
  • Sang Ho Jeon
  • Seungwu Han
  • Jeong Hwan Kim
  • Tae Joo Park
  • Byeong-Gyu Park
  • Cheol Seong Hwang
چکیده

The structural and electronic properties of HfO2 thin films grown by atomic layer deposition (ALD) under various ozone concentrations were investigated using X-ray diffraction (XRD), photoemission (XPS), reflectometry (XRR), and absorption spectroscopy (XAS) and their fine structure (XAFS) analysis. It was found that in the as-grown states, the oxygen stoichiometry and local atomic structure in amorphous HfO2 domains are maintained nearly as constants even when the film is grown without external ozone supply, while some C−O bonds remain between the almost stoichiometric HfO2 domains due to incomplete oxidation of the precursors. After a postdeposition annealing (PDA), the films crystallize with a monoclinic structure (P21/c), except for the case of the no-ozone supply in which the film possesses a tetragonal crystal structure (P42/nmc). It is demonstrated that the carbonate bonds play a major role in stabilizing the tetragonal structure through nanoscale separation of the HfO2 domains. Accordingly, the roles of the oxygen source and the PDA are also newly addressed as being related to the carbonate bonds. The ozone gas acts as an oxygen supplier, and more importantly, it reduces the residual carbonates to stabilize the bulk crystal structure in the thin films. The PDA not only delivers the thermal energy to induce the crystallization but also eliminates C atoms to increase the size of the HfO2 domains leading to the densification of the films.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Bipolar Resistive Switching Characteristics of HfO2/TiO2/HfO2 Trilayer-Structure RRAM Devices on Pt and TiN-Coated Substrates Fabricated by Atomic Layer Deposition

The HfO2/TiO2/HfO2 trilayer-structure resistive random access memory (RRAM) devices have been fabricated on Pt- and TiN-coated Si substrates with Pt top electrodes by atomic layer deposition (ALD). The effect of the bottom electrodes of Pt and TiN on the resistive switching properties of trilayer-structure units has been investigated. Both Pt/HfO2/TiO2/HfO2/Pt and Pt/HfO2/TiO2/HfO2/TiN exhibit ...

متن کامل

Atomic layer deposition of thin hafnium oxide films using a carbon free precursor

Thin HfO2 films have been deposited on silicon via atomic layer deposition using anhydrous hafnium nitrate @Hf(NO3)4# . Properties of these films have been investigated using x-ray diffraction, x-ray reflectivity, spectroscopic ellipsometry, atomic force microscopy, x-ray photoelectron spectroscopy, and capacitance versus voltage measurements. Smooth and uniform initiation of film growth has be...

متن کامل

Damage evaluation in graphene underlying atomic layer deposition dielectrics

Based on micro-Raman spectroscopy (μRS) and X-ray photoelectron spectroscopy (XPS), we study the structural damage incurred in monolayer (1L) and few-layer (FL) graphene subjected to atomic-layer deposition of HfO2 and Al2O3 upon different oxygen plasma power levels. We evaluate the damage level and the influence of the HfO2 thickness on graphene. The results indicate that in the case of Al2O3/...

متن کامل

Thermal decomposition behavior of the HfO2 ÕSiO2 ÕSi system

We report on the thermal decomposition of uncapped, ultrathin HfO2 films grown by chemical vapor deposition on SiO2 /Si(100) substrates. Medium energy ion scattering, x-ray photoelectron spectroscopy, scanning electron microscopy and atomic force microscopy were used to examine the films after they had been annealed in vacuum to 900–1050 °C. Film decomposition is a strong function of the HfO2 o...

متن کامل

Surface Passivation of Silicon Using HfO2 Thin Films Deposited by Remote Plasma Atomic Layer Deposition System

Hafnium oxide (HfO2) thin films have attracted much attention owing to their usefulness in equivalent oxide thickness scaling in microelectronics, which arises from their high dielectric constant and thermodynamic stability with silicon. However, the surface passivation properties of such films, particularly on crystalline silicon (c-Si), have rarely been reported upon. In this study, the HfO2 ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2012